| 号数 | ばね論文集４１号（１９９６年） |
| ページ数 | pp.53-64 |
| 種類 | 共同研究報告 |
| 論文名 | ばね用薄板・細線の硬さ・引張り・疲労試験法に関する共同研究 |
| Title | Study on Test Method of Mechanical Properties for Thin Plates and Fine Wires for Spring use. |
| 著者 | ばね技術研究会 |
| Author | Research Committee for Electronic Materials & Components |
| 抄録 | 電子材料・部品委員会は，共同研究とアンケートを基に，ばね用薄板と細線の機械的性質を特定する試験法を審議し標準案を報告した。最も基本的な特性として硬さ試験，引張試験および疲労試験の３者を対象とした。特に，厚さ0.2mm以下のばね用薄板，直径0.2mm以下の細線に対する試験方法を規定し解説も含めて，日本ばね工業会規格(JSMA)案として提示した。一般的なJIS Z 2244「ビッカース硬さ試験法」，JIS Z 2241「金属材料引張試験方法」との相違点も詳述した |
| Abstract | Standardization of characterization methods
of mechanical properties of thin plates and
fine wires is reported. These plates and wires are used for electronics equipment in the variety of fields such as information, telecommunication, office automation, automatic control or transportation. Variety of mechanical properties of thin plates and fine wires were investigated in the antecedents of the research committee for electronic materials & component, the committee on strength of flat spring and the committee for characterization of spring materials in electronic use. Among these characteristics, most fundamental tests of hardness test, tensile test and fatigue test are reported. Especially, common testing methods for thin plates with less than 0.2mm thickness and fine wires with less than 0.2mm diameter are reported to propose standardization of testing method to be authorized by Japan springs manufacturer's association. |
| 著者の所属 | |
| Belonging | |
| Key Words | Test method, Mechanical properties, Thin plates, Fine wires, Hardness test, Tensile test, Fatigue test |